Item |
HVM |
LVM |
Layers |
2-6 |
8-10 |
Min. welding ring (¡Ü1.0OZ) |
Component hole |
6mil
for each side |
5mil
for each side |
| Max Board Size |
¡Ý1.2mm |
18¡å¡Á 24¡å |
21¡å¡Á 24¡å |
0.8~1.0mm |
16¡å¡Á 18¡å |
16¡å¡Á 18¡å |
¡Ü0.6mm |
14¡å¡Á 16¡å |
16¡å¡Á 18¡å |
Min Line Width/Space |
0.5OZ |
L/S=4.5/6mil |
L/S=3.5/5.5mil |
1.0OZ |
L/S=5/8mil |
L/S=4/6mil |
2.0OZ |
L/S=7/9mil |
L/S=7/8mil |
3.0OZ |
L/S=8/16mil |
L/S=7/14mil |
4.0OZ |
L/S=10/20mil |
L/S=8/18mil |
Thickness of Final Board |
0.6~2.4mm |
0.43~0.6mm
2.5~3.0mm |
Tolerance of line width |
¡À20% |
¡À10~15% |
Copper Thickness of Inner Layers |
0.5£2 OZ |
3 OZ |
Copper Thickness of Outer Layers |
0.33£2 OZ |
3~5 OZ |
Pattern plating |
Average Cu thickness of hole wall |
¡Ü1.0mil |
¡Ü1.5mil |
Aspect ratio |
4.57:1
(1.6mm/0.35mm) |
8:1 |
Min. diameter of hole |
¡é0.35mm |
¡é0.30mm |
Tolerance of hole position |
¡À2mil |
¡À2mil |
Diameter tol. |
PTH |
¡À3mil |
¡À2mil |
NPTH |
¡À2mil |
¡À2mil |
Min space between Hole/ line and contour |
20mil (0.5mm)
12mil (0.3mm) |
16mil (0.4mm)
10mil (0.25mm) |
Min. thickness of inner layer |
0.25mm |
0.19mm |
Min. isolation pad |
10mil |
8 mil |
Tolerance of profile dimension |
¡À0.15mm |
¡À0.10mm |
Other |
IPC¢ò¡¢¢ó |
