深圳市华丰电器器件制造有限公司

项目		大批量		小批量
最高层数		2-6		8-10
最小孔环 (≤1.0OZ)	零件孔	单边6mil		单边5mil
最大发料尺寸	≥1.2mm	18″× 24″		21″× 24″
	0.8~1.0mm	16″× 18″		16″× 18″
	≤0.6mm	14″× 16″		16″× 18″
最小线宽/间距	0.5OZ	L/S=4.5/6mil		L/S=3.5/5.5mil
	1.0OZ	L/S=5/8mil		L/S=4/6mil
	2.0OZ	L/S=7/9mil		L/S=7/8mil
	3.0OZ	L/S=8/16mil		L/S=7/14mil
	4.0OZ	L/S=10/20mil		L/S=8/18mil
成品板厚		0.6~2.4mm		0.43~0.6mm 2.5~3.0mm
线宽公差		±20%		±10~15%
内层铜厚		0.5－2 OZ		3 OZ
外层铜厚		0.33－2 OZ		3~5 OZ
图形电镀	平均孔铜厚度	≤1.0mil		≤1.5mil
	纵横比	4.57:1 (1.6mm/0.35mm)		8:1
最小钻孔径		￠0.35mm		￠0.30mm
孔位公差		±2mil		±2mil
成品孔径公差		PTH	±3mil	±2mil
		NPTH	±2mil	±2mil
孔/线到外型边最小间距		20mil (0.5mm) 12mil (0.3mm)		16mil (0.4mm) 10mil (0.25mm)
最小内层厚度		0.25mm		0.19mm
最小隔离环		10mil		8 mil
外型尺寸公差		±0.15mm		±0.10mm
其它		IPCⅡ、Ⅲ